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Our new Euroflow design includes a new heater control system designed to overcome the most common problem with lead-free soldering, which is the varying temperature across the substrate. The ovens are divided into pre-heat, soak and reflow zones along the length of the conveyor, but we also have zones of control across the conveyor. So the heat input is controlled from edge to edge over the whole width of the conveyor, ie front edge, centre, and back edge. This means that the operator can now easily overcome the problem of temperature variation across the substrate.
- Two sided boards, fine pitch ICs, BGA assemblies, hidden chip components - No problem!
- No shaddowing or colour sensitivity.
- New "Euroflow" design for thermal uniformity.
- High performance with low energy consumption compared with hot air systems!
By using a combination of quick response, long-wave ceramic heater panels within the processing chamber with hot air convection flow, power consumption is kept to a minimum. And yet thermal stability is so optimised to allow for "nose to tail" p.c.b. loading, and single-profile processing is used for the majority of substrate types. Full production or small batches may be run with no profile change and no instability. |